Semiconductor device having a well structure for improving soft error rate immunity and latch-up immunity and a method of making such a device

ABSTRACT

A semiconductor device with improved soft error rate immunity and latch-up immunity and a method of forming the same. The device includes first wells of first conductivity type and second well of second conductivity type formed in the semiconductor substrate of first conductivity type. First conductivity type MOSFETs including source/drain of first conductivity type are formed in the second well, and second conductivity type MOSFETs including source/drain of second conductivity type in the first well. A third well of second conductivity type is formed at a region under the first wells and the drain of the second conductivity type MOSFETs. The first well is connected to the semiconductor substrate between the first well and the third well.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Divisional of U.S. patent application Ser. No. 10/961,927, filed Oct. 8, 2004, now pending, which claims priority under 35 U.S.C. § 119 of Korean Patent Application No. 2003-70310, filed Oct. 9, 2003. The entire contents of which are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of this Invention

This invention relates to semiconductor memory devices and to methods of fabricating semiconductor memory devices. More particularly, the present invention relates to semiconductor memory devices that have a well structure for improving soft error rate immunity and latch-up immunity and to a method of fabricating such devices.

2. Description of Prior Art

Complementary metal oxide semiconductor devices (CMOS devices) have excellent power dissipation, noise margin and reliability characteristics, and they are widely used in many semiconductor products including memories, microprocessors and application specific integrated circuits (ASICs).

CMOS devices may not only be used in memory cell regions but they may also be used in peripheral circuit regions of static RAMs (SRAMs). SRAMs that use CMOS devices have small standby current requirements and high data retention. The unit cell of an SRAM generally includes two driver transistors, two access transistors and two load transistors. The driver and access transistors in an SRAM cell can be NMOSFETs and the load transistors can be PMOSFETs. Such unit cells, called “a full CMOS cells,” require only a small standby current and they have a large noise margin. They are therefore widely used in high-performance SRAMs that have a low power supply voltage.

CMOS devices such as CMOS inverters may sometimes suffer from problems such as soft errors and latch-up. A soft error is a process in which an electron-hole pair (EHP) generated in the semiconductor substrate by alpha particles or cosmic ray, destroys information stored in the memory cell. This loss of information occurs when electric charges in specific nodes (e.g., a lower electrode of the capacitor in the DRAM or a drain of the driver transistor in the SRAM) exceed a critical quantity. Even if a semiconductor device is highly integrated, the capacitor in a DRAM must have a relatively high capacitance. As a result, soft errors in DARMs do not present a significant problem in highly integrated DARMs. However, since SRAMs do not use a capacitor as the memory cell for storing information, reduction of capacitance accompanies high integration. Consequently, as the integration of SRAMs is increased, a technique for improving the soft error rate immunity is highly desired.

One conventional technique for improving the soft error rate immunity is disclosed in U.S. Pat. No. 5,877,051. Such a prior art technique is illustrated in FIG. 1 which is a schematic cross-sectional view of a semiconductor device.

As shown in FIG. 1, a plurality of N-wells 20 n and P-wells 20 p are disposed in predetermined regions of the semiconductor substrate 10. A plurality of PMOSFETs are formed at the N-well 20 n, and a plurality of NMOSFETs are formed at the P-well 20 p. The NMOSFETs and the PMOSFETs include a gate insulation layer 50 and gate electrodes 30. The gate insulation layer 50 is formed on the active region defined by the device isolation layer 15 and the gate electrodes 30 are formed on the gate insulation layer 50. In addition, the NMOSFETs include N-type impurity regions 40 n formed in the P-well 20 p, and the PMOSFETs include P-type impurity region 40 p formed in the N-well 20 n. These NMOSFETs and PMOSFETs can be connected with predetermined interconnections (not shown) to form a CMOS inverter, a flip-flop circuit, a CMOS SRAM cell or the like.

In a conventional method of improving the soft error rate immunity, a deep N-well 60 n is formed under the P-well 20 p. The deep N-well 60 n plays a role in reducing the generation EHPs by shortening the funneling length of high energy particles. In addition, the deep N-well 60 n collects a part of the charges generated by high energy particles to decrease the electric charges accumulated in a node of the inverter. However, the deep N-well 60 n may deteriorate the latch-up immunity.

Latch-up is an important technical problem in CMOS devices. Latch-up is described in various textbooks. For example, see “Device Electronics for Integrated Circuits”, pp. 458-456, by Richard S. Muller and Theodore I. Kamins. Latch-up results from the structure of parasitic thyristor formed by the NMOSFETs and PMOSFETs. As described by Muller, susceptibility to latch-up may be decreased by reducing well resistance. This reduction in well resistance enables the electrons to be discharged fast, so as to prevent an abnormal variation of the well potential. Latch-up may be particularly serious in case of holes rather than electrons because of the difference in mobility. Therefore, the art of reducing the latch-up susceptibility is generally focused on reducing the electric resistance of the P-well 20 p.

FIG. 2 is a cross-sectional view for illustrating a prior art method of reducing the P-well resistance. FIGS. 3A and 3B are resistor circuit diagrams for illustrating schematically electric resistances of the P-wells in FIGS. 1 and 2, respectively.

First, as shown in FIG. 1, the bottom surface and the sidewall of the P-well 20 p are surrounded by N-type wells 20 n and 60 n. This configuration corresponds to a long-line shaped resistor structure shown in FIG. 3A. The resistance of the P-well 20 p is determined by distances between conductive structures (e.g., well strappings) that are connected to the P-well 20 p in the state of forward bias. The integration density of the conductive structures connected to the P-well 20 p should be increased to decrease the well resistance. However, this method for increasing a density of the well pick-up is undesirable because it may degrade integration density of the semiconductor devices.

As illustrated in FIG. 2, the well structure may be formed without forming the deep N-well 60 n. In this case the N-type wells 20 n and 60 n do not surround the P-well 20 p. As illustrated in FIG. 3B, the well structure corresponds to a resistor structure that wells are connected in parallel. This parallel connection structure of resistor reduces the resistance of the P-well 20 p, and the latch up susceptibility can be decreased. However, the well structure without the deep N-well 60 n formed under the P-well 20 p results in reducing the soft error immunity.

SUMMARY OF THE INVENTION

The present invention provides a CMOS device that has improved soft error and latch up immunities.

A CMOS device according to the present invention includes first wells of first conductivity type and second wells of second conductivity type formed in a semiconductor substrate of first conductivity type. A first conductivity type MOSFETs including a source and drain of first conductivity type are formed in the second well. A second conductivity type MOSFETs including a source and drain of a second conductivity type are formed in the first well. A third well of a second conductivity type disposed under both the first wells and the drain of the second conductivity type MOSFETs.

The first wells can be connected to the semiconductor substrate between the third wells. A fourth well of first conductivity type can be disposed in the semiconductor substrate under and between the third wells, and the first wells can be connected to the fourth well between the third wells. The third well can be connected to a bottom of the second well. The third well can be formed under the entire region of the second well.

The first conductivity type MOSFETs can form the load transistors of an SRAM, and the second conductivity type MOSFETs can form the driver transistors and the transfer transistors of an SRAM.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view illustrating a well structure of CMOS device according to one embodiment of the prior art.

FIG. 2 is a cross-sectional view illustrating a well structure of CMOS device according to another embodiment of the prior art.

FIG. 3A and FIG. 3B are schematic resistor-circuit diagrams illustrating electric resistors of the CMOS devices in FIG. 1 and FIG. 2.

FIG. 4 is an equivalent circuit diagram of a conventional CMOS SRAM cell.

FIGS. 5A through 8A are top plan views illustrating one embodiment of the present invention adapted in a memory cell of a CMOS SRAM cell.

FIGS. 5B through 8B are cross-sectional views taken along a dotted line I-I′ in FIGS. 5A through 8A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It is noted that in the drawings, the thickness of layers and regions are exaggerated for clarity. It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.

The present invention may be applied to the memory cells of CMOS SRAMs. One embodiment of the present invention applied to a CMOS SRAM will be explained with reference to FIGS. 5A through 8A and FIGS. 5B through 8B. However, the present invention may also be used in various other CMOS devices including CMOS inverters (for example, CMOS devices such as a flip-flop circuits).

A conventional CMOS SRAM cell will be explained first. FIG. 4 illustrates an equivalent circuit diagram of the CMOS SRAM cell that includes a CMOS device including a CMOS inverter.

Referring to FIG. 4, the CMOS SRAM cell comprises a pair of driver transistors TD1 and TD2, a pair of transfer transistors TA1 and TA2 and a pair of load transistors TL1 and TL2. The pair of driver transistors TD1 and TD2 and the pair of transfer transistors TA1 and TA2 are all NMOS transistors, but the pair of load transistors TL1 and TL2 are PMOS transistors.

The first driver transistors TD1 and the first transfer transistor TA1 are connected in series. A source region of the first driver transistor TD1 is connected to a ground line Vss, and a drain region of the first transfer transistor TA1 is connected to a first bit line BL. Similarly, the second driver transistor TD2 and the second transfer transistor TA2 are connected in series. A source region of the second driver transistor TD2 is connected to the ground line Vss, and a drain region of the second transfer transistor TA2 is connected to a second bit line/BL.

The source region and the drain region of the first lead transistor TL1 are connected to the power line Vcc and the drain region of the first driving transistor TD1, respectively. Similarly, the source region and the drain region of the second load transistor TL2 are connected to the lower line Vcc and the drain region of the second driving transistor TD2, respectively. The drain region of the first load transistor TL1, the drain region of the first driving transistor TD1 and the source region of the first transfer transistor TA1 correspond to a first node N1. In addition, the drain region of the second load transistor TL2, the drain region of the second driver transistor TD2 and the source region of the second transfer transistor TA2 correspond to a second node N2. The gate electrode of the first driver transistor TD1 and the gate electrode of the first load transistor TL1 are connected to the second node N2. The gate electrode of the second driver transistor TD2 and the gate electrode of the second load transistor TL2 are connected to the first node N1. In addition, gate electrodes of first and second transfer transistors TA1 and TA2 are connected to a word line WL.

FIGS. 5A, 6A, 7A and 8A are top views illustrating one embodiment of the present invention applied to a CMOS SRAM memory cell. FIGS. 5B, 6B, 7B and 8B are cross-sectional views each taken along a dotted line I-I′ in FIGS. 5A, 6A, 7A and 8A.

Referring to FIG. 5A and FIG. 5B, a device isolation layer 105 is formed in a predetermined region of the semiconductor substrate 100 to define first and second active regions 110 a and 110 b. The device isolation layer 105 may be formed by a conventional device isolation technique, for example, a trench device isolation technique. In this case, a conductivity type of the semiconductor substrate 100 may be P type but alternatively in other embodiments it can be N type.

The first active region 110 a is a region where the first and second driver transistors TD1 and TD2 and the first and second transistors TA1 and TA2 are formed. One of the first active regions 110 a is symmetrically formed on the basis of a boundary of the unit cell 200 in neighboring two unit cells 200. Especially, the first active region 110 a forms a closed line including two internal protruding parts.

The second active region 110 b is the region where the first and second load transistors TL1 and TL2 are formed. In the neighboring two unit cells 200, one of the second active regions 110 b is formed symmetrically on the basis of a boundary of the unit cell 200. Especially, the second active region 110 b forms H-shape in the neighboring unit cells 200 as illustrated in FIG. 5A. Meanwhile, the first and second active regions 110 a and 110 b disposed in a predetermined unit cell 200 are placed across different neighboring unit cells 200, respectively.

Referring to FIGS. 6A and 6B, a deep P-well 120 p is formed in semiconductor substrate 100 including the device isolation layer 105. The deep P-well 120 p may be formed using an ion-implantation technique. Preferably, the deep P-well 120 p is formed on an entire surface of the semiconductor substrate 100 using a blanket ion implantation technique. However, alternatively, the deep P-well 120 p may be formed in a predetermined region of the substrate (e.g., a memory cell array region, etc.).

The deep P-well 120 p plays a role in reducing the electrical resistance of each of the P-wells 130 p by connecting the P-wells 130 p (in FIGS. 7A and 7B) which are formed in parallel in a subsequent process. Deep P-well 120 p may have a depth such that a top portion of the deep P-well 120 p is connected to a bottom portion of the P-wells 130 p. According to one embodiment of the present invention, the deep P-well 120 p is formed with a depth of about 0.3 to 1.0 μm below the top surface of the semiconductor substrate 100, so as to have a thickness of 0.3 to 1.0 μm downwardly.

Deep N-wells 120 n are formed in the semiconductor substrate 100 including the deep P-well 120 p. The deep N-wells 120 n are formed locally in predetermined regions of the semiconductor substrate 100 instead of being formed in an entire surface of the semiconductor substrate 100. This is in contrast to the deep P-well 120 p. The deep N-wells 120 n may be formed under a portion of the N-type impurity regions of the NMOSFET, which is completely formed in subsequent processes.

In CMOS SRAMs, the deep N-wells 120 n are formed under the drains of the first and second driver transistors TD1 and TD2, which will be formed in subsequent processes. That is, the deep N-wells 120 n are formed under four edges of the first active region 110 a as illustrated in FIG. 6A.

The deep N-wells 120 n may be formed inside the deep P-well 120 p with a thickness thinner than that of the deep P-well 120 p (see FIG. 6B). Therefore, the deep P-well 120 p is disposed between the deep N-wells 120 n.

In an alternate embodiment, the order of forming the deep P-well 120 p and the deep N-well 120 n is changed. That is, after the deep N-well 120 n is formed first, the deep P-well 120 p may be formed.

Referring to FIGS. 7A and 7B, a P-well 130 p and an N-well 130 n are sequentially formed in the semiconductor substrate 100 including the deep P-well 120 p and the deep N-well 120 n. The P-well 130 p and the N-well 130 n are disposed over the deep P-well 120 p and the deep N-well 120 n, neighboring to each other.

The P-wells 130 p are formed in the first active region 110 a, and the N-wells 130 n are formed in the second active region 110 b. The P-well 130 p and the N-well 130 n may be formed using ion implantation. The ion implantation process used to form the P-well 130 p uses a mask for screening the second active region 110 b but opening the first active region 110 a. The ion implantation process for forming the N-well 130 n may use a mask for screening the first active region 110 a but opening the second active region 110 b. Therefore, the P-wells 130 p are connected to a top portion of the deep P-well 120 p having the same conductivity type as that of the P-wells 130 p. The N-wells 130 n is connected to a top portion of the deep N-wells 120 n having the same conductivity type as that of the N-wells 130 n. Meanwhile, the deep N-wells 120 n may be formed under an entire bottom surface of the N-well 130 n. However, the deep N-wells 130 n may be connected to the N-well 130 p only at predetermined regions.

Alternatively, the order of forming the P-well 130 p and the N-well 130 n may be exchanged. That is, the P-well 130 p may be formed after the N-well 130 n is formed. In addition, the orders of forming the P-well 130 p, the N-well 130 n, the deep P-well 120 p and the deep N-well 120 n may be exchanged according to various combinations.

The deep P-well 120 p is disposed between the deep N-wells 120 n and connected to a bottom of the P-wells 130 p, as illustrated FIGS. 6A and 6B, such that electrical resistances of the P-wells 130 p may be lowered. Holes in the P-well 130 p may be effectively discharged by lowering the electric resistance of the P-well 130 p. Therefore, a latch up caused by a voltage variation of the P-well 130 p can be decreased.

According to another embodiment of the present invention, the deep P-well 130 p may not be formed. In this case, an electric resistor of the P-wells 130 p may be reduced by the semiconductor substrate 100 of the same conductivity type as that of the P-well 130 p. For this embodiment, the N-wells 120 n is formed locally so as to connect the P-wells 130 p to the semiconductor substrate 100.

Referring to FIGS. 8A and 8B, a gate insulation layer 140 is formed on the semiconductor substrate where the P-well 130 p and the N-well 130 n are formed, using a conventional technique (e.g., a thermal oxidation process).

A gate conductive pattern 150 to be used as the gate electrode of the transistor is formed on the gate insulation layer 140. Afterwards, at least two ion implantation processes are performed, which have different open regions according to the conductivity type of the transistors. The ion implantation processes use the gate conductive patterns 150 as an ion implantation mask in addition to conventional photoresist patterns (not shown). As a result, first impurity regions 160 b and 160 b′ of N-type are formed in the first active region 110 a neighboring the gate conductive patterns 150. Second impurity region 160 a of P-type are formed in the second active region 110 b neighboring the gate conductive patterns 150.

The first impurity regions 160 b and 160 b′ and the gate conductive pattern 150 compose the first and second driver transistors TD1 and TD2 and the first and second transfer transistors TA1 and TA2 shown in FIG. 4. In addition, the second impurity regions 160 a and the gate conductive patterns 150 compose the first and second load transistors TL1 and TL2.

Afterwards, an interconnection process is further performed to connect the first and second impurity regions 160 a, 160 b and 160 b′ to the gate conductive patterns 150 so as to connect the transistors to form a CMOS SRAM cell.

According to the present invention, the deep N-wells are locally disposed under a drain of the NMOSTET which is weak in a soft error. Therefore, funneling length of a high-energy particle can be reduced and the generated electrodes can be effectively discharged. As a result, a CMOS device has low susceptibility with respect to the soft error.

In addition, the P-well where the NMOSFET is formed is connected to the deep P-well between the deep N-wells. Therefore, the electric resistance of the P-well can be reduced to fabricate a CMOS device having low susceptibility with respect to the latch up.

In summary, according to one embodiment of the present invention, first wells of first conductivity type and second wells of second conductivity type are formed in a first conductivity type semiconductor substrate. First conductivity type MOSFETs having a first conductivity type source/drain are formed in the second well, and second conductivity type MOSFETs having a second conductivity type source/drain are formed in the first well. A third well of second conductivity type is formed under both the first wells and a drain of the second conductivity type MOSFETs.

The first conductivity type may be P type, and the second conductivity type may be N type. The first conductivity type MOSFETs and the second conductivity type MOSFETs may compose a CMOS inverter or a flip-flop circuit. In addition, the first conductivity type MOSFETs composes load transistors of SRAM, and the second conductivity type MOSFETs may compose driver transistors and transfer transistors of the SRAM. In addition, the first well may be connected to the semiconductor substrate between the third wells.

A fourth well of first conductivity type can be disposed in the semiconductor substrate under the third wells and between the third wells. In this case, the first wells are connected to the fourth well between the third wells. In addition, the third well may be connected to a bottom of the second well, and may be formed at the region under the entire second well.

The present invention may be adapted to an SRAM semiconductor device including first and second driver transistors formed in a semiconductor substrate, first and second transfer transistors and first and second load transistors. The SRAM semiconductor device includes an N-well where the first and second driver transistors are located, a P-well where the first and second transfer transistors are located, and an N-well where the first and second load transistors are located. In addition, a deep N-well is located in the region under both drains of the driver transistors and the P-well.

A deep P-well connected to a bottom of the P-well may be disposed between the deep N-wells. In this case, the deep P-well may be disposed under the deep P-well at an entire region of the semiconductor substrate. In addition, the deep N-well may be connected to a bottom of the deep N-well.

The present invention also provides a method of forming the described semiconductor device. The method includes forming a well locally at a predetermined region of the semiconductor substrate. The method also includes a step of forming first wells of first conductivity type and second wells of second conductivity type in the semiconductor substrate. Third wells of second conductivity type are formed in the semiconductor substrate, which are connected to the second well and disposed under a predetermined region of the first wells. Afterwards, the first conductivity type MOSFETs including a first conductivity type are formed in the second well, and second conductivity type MOSFETs including second conductivity type source/drain are formed in the first well.

The step of forming the first wells may be performed before or after the second wells are formed, and the step of forming the third wells may be performed before or after the first wells and the second wells. The step of forming the first conductivity type MOSFETs may be performed before or after the second conductivity type MOSFETs.

In addition, the step of forming a fourth well of first conductivity type under the third wells and in the semiconductor substrate between the third wells may be performed before or after the third wells are formed.

Preferably, the first conductivity type is P type, and the second conductivity type is N type; the alternative is possible. In addition, after the first MOSFETs and the second MOSFETs are formed, interconnections for connecting source/drain terminals of the first and second MOSFETs may be further formed so as to make the first MOSFET and the second MOSFET form a CMOS inverter. In this case, the third wells may be further formed under a source/drain terminal of the first MOSFETs connected to by the interconnections.

The present invention provides a method of forming a semiconductor device for forming a deep N-well locally in a predetermined region of the semiconductor substrate. This method includes a step of forming P-wells and N-wells disposed over the deep N-well in the semiconductor substrate after deep N-wells are formed in a predetermined region of the semiconductor substrate. In this case, the P-wells are connected to the semiconductor substrate between the deep N-wells, and the N-wells are connected to the deep N-well. Load transistors of the SRAM are formed in the P-well, and driver transistors of SRAM and transfer transistors are formed in the N-well. Preferably, the deep N-well is formed in the region under both the drain of the driver transistor and the P-well.

A person skilled in the art will be able to practice the present invention in view of the description present in this document, which is to be taken as a whole. Numerous details have been set forth in order to provide a more thorough understanding of the invention. In other instances, well-known features have not been described in detail in order not to obscure unnecessarily the invention.

While the invention has been disclosed in its preferred embodiments, the specific embodiments as disclosed and illustrated herein are not to be considered in a limiting sense. Indeed, it should be readily apparent to those skilled in the art in view of the present description that the invention may be modified in numerous ways. The invention includes all combinations and sub-combinations of the various elements, features, functions and/or properties disclosed herein.

The following claims define certain combinations and sub-combinations, which are novel and non-obvious. 

1. A method of forming a CMOS semiconductor device, the method comprising: forming first wells of first conductivity type in a semiconductor substrate; forming second wells of second conductivity type in the semiconductor substrate; forming third wells of second conductivity type in the semiconductor substrate, the third well being connected to the second well and disposed under a region of the first wells; forming a first conductivity type MOSFETs including source/drain of first conductivity type in the second well; and forming second conductivity type MOSFETs including source/drain of second conductivity type in the first well.
 2. The circuit of claim 1, wherein the forming of the first wells is performed before or after the second wells are formed, wherein the forming of the third wells is performed before or after the first and second wells are formed, and wherein the forming of the first conductivity type MOSFETs is performed before or after the second conductivity type MOSFETs are formed.
 3. The method of claim 1, before or after the third wells are formed, further comprising: forming a fourth well of first conductivity type in a semiconductor substrate under and between the third wells.
 4. The method of claim 1, wherein the first conductivity type is P type and the second conductivity type is N type.
 5. The method of claim 1, after the first MOSFET and the second MOSFET are formed, further comprising: forming an interconnection for connecting source/drain terminals and the gate terminals of the first and second MOSFETs so as to make the first MOSFET and the second MOSFET compose a CMOS inverter.
 6. The method of claim 4, wherein the third wells are formed under the source/drain terminal of the first MOSFET connected by the interconnection.
 7. A method of forming an SRAM device, comprising: forming deep N-wells in a predetermined region of a semiconductor substrate; forming P-wells disposed on the deep N-well in the semiconductor substrate and connected to the semiconductor substrate between the deep N-wells; forming N-wells disposed on the deep N-well in the semiconductor substrate and connected to the deep N-well; and forming load transistors of the SRAM at the P-well and forming driver transistors and transfer transistors of the SRAM at the N-well.
 8. The method of claim 6, wherein the deep N-well is formed at a region under both a drain of the driver transistor and the P-well.
 9. The method of claim 6, wherein before the deep N-well is formed, further comprising: forming a deep P-well at a substantially entire surface of the semiconductor substrate; and wherein the deep P-well is connected to the P-well between the deep N-wells. 